Enhanced Electrical Performance

• Innovex-designed flex circuits eliminate transitions between substrates and connectors to control impedance and improve Electromagnetic Interference (EMI) / Radio Frequency Interference (RFI).

Miniaturization in the form of high density interconnects

Extreme Thinness

• Capabilities of 25 micron thickness and below
• Conforms to tight spaces enabling miniaturization for a wide range of applications

Light-weight for portable applications

Flexibility

• Dynamic material for applications requiring flex endurance
• Circuits can be bent and creased to form complex 3-dimensional geometrics