|
Adhesive Platforms |
|
|
|
|
|
Single Metal Layer /
Single Side Access:
The single conductor layer platform is the most
cost-effective solution which provides the widest range of flexible motion and the longest
flex fatigue life.

View technical
specifications for this platform
|
| Cover
Layer |
|
Adhesive |
|
Copper Foil |
|
|
Adhesive |
|
Base
Film |
Adhesive |
|
Stiffener |
|
|
|
. |
|
|
Single Metal Layer /
Double Side Access:
Provides increased design flexibility by accessing a single
copper layer from either side of the circuit in a dynamic flex circuit application.

View technical
specifications for this platform
|
| Cover Layer |
|
Cover Layer |
Adhesive |
|
Adhesive |
|
Copper
Foil |
|
Adhesive |
|
Adhesive |
Base
Film |
|
Base
Film |
|
|
Stiffener |
|
|
|
|
|
. |
|
|
Double Metal Layer:
Achieve the size benefits and flexibility of a single sided
circuit, with the functional advantages of a double sided circuit. A single conductive
copper layer can be accessed from both sides of the circuit via pre-drilled holes.

View technical
specifications for this platform
|
| Cover Layer |
|
|
|
|
|
|
Adhesive |
|
|
| Copper Foil |
|
|
|
Copper Foil |
Adhesive |
|
|
|
Adhesive |
Base Film |
|
|
|
Base Film |
Adhesive |
|
|
|
Adhesive |
Copper Foil |
|
|
|
Copper Foil |
|
|
Adhesive |
|
|
| Cover Layer |
|
|
|
|
|
|
Adhesive |
|
|
|
|
Stiffener |
|
|
|
|
Adhesiveless Platforms |
|
|
|
|
|
Technology
Roadmap for Adhesiveless Platforms
|
|
|
Single Metal Layer /
Single Side Access:
The single conductor layer platform minimizes space
requirements and provides superior heat resistance, enhanced electrical characteristics
and improved dimensional stability in a static flex circuit application.

View technical
specifications for this platform
|
| Cover Layer |
|
Copper Foil |
|
Base Film |
|
|
Adhesive |
|
Stiffener |
|